SMT Termički profiliranje

Potrebno profiliranje od ponovnog relata zahtijeva 4- faza optimizaciju: zagrijati (1-3 stepen / s), namočite (60-120 s 150-180 stepen), reflim (30-60 S iznad 217 stepeni), hlađenjem (<6°C/s). KIC thermal profilers use predictive algorithms for complex boards. Thermocouples attach to thermal mass areas for accuracy. Nitrogen environments permit 10°C lower peak temperatures. Ramp-to-spike profiles reduce tombstoning. DOE methods correlate profile settings with shear strength. Standards: IPC-7531 guidelines for profile validation.